Prof. Cees De Bont (Keynote Speaker)

Loughborough University, UK

Biography: Cees de Bont is the dean of Loughborough School of Design and Creative Arts School. Before that, Cees was the dean of the Faculty of Industrial Design Engineering of the Delft University of Technology (2005-2011) and dean of the School of Design of the Hong Kong Polytechnic University (2012-1018). Cees also worked for Royal Philips Electronics in various leadership roles related to design, marketing and strategy (1995-2005).
Cees co-authored many academic papers in top journal, such as: Design Studies, Design Issues, International Journal of Design, Journal of Product Innovation Management, She ji: The Journal of Design, Economics and Innovation, Journal of Engineering Design, etc. His academic interests are in design education, consumer behavior, the adoption of innovations and responsible design.
Cees de Bont holds a BSc in Psychology and a MSc in Consumer Psychology from Tilburg University and a PhD from Delft University of Technology (1992). In 2017, Cees won the ICoNNN Award.

Prof. Wei Bai (Keynote Speaker)

China University of Geosciences (Wuhan), China

Keynote Lcture: Vibration Assisted Machining for Aerospace and Biomedical Applications

Abstract: Difficult-to-cut materials play an important role in the growing demand for high value-added parts. Because of its excellent performance, it is widely used in aerospace, and biomedical fields. Machining of the difficult-to-cut materials such as high-performance alloys, composite materials, and hard-brittle materials leads to large cutting force, severe tool wear, and poor processing quality. Therefore, achieving high-quality and efficient machining of difficult-to-cut materials is a challenging scientific and engineering problem. Vibration-assisted machining technology is to apply a certain frequency of micron-level amplitude to the tool to realize the periodic change of the relative position of the tool and the workpiece, and to obtain better material machinability than conventional machining. Ultrasonic-assisted and elliptical vibration cutting can extend the machining performance of difficult-to-cut materials through amplitude and frequency adjustment. However, the mechanism of the material removal and the machinability extension need to be investigated urgently.

This topic presents an improved orthogonal cutting model considering the main shear zone and chip contact zone. Based on the analysis of the kinematic characteristics and transient parameters of the one-dimensional and two-dimensional vibration cutting process, the analytical modelling and force prediction of the vibration-assisted cutting is achieved. The microstructure evolution model of vibration-assisted cutting is established, and the visualization of the microstructure evolution of the cutting process is realized. For the superalloys and metal matrix composites in the aerospace field, the machinability experiments were carried out, and the remarkable superiority of vibration-assisted cutting was verified. As for biological hard-brittle bone tissue, the crack propagation and chip formation in ultrasonic cutting was studied, and the mechanism of crack penetration in high strain rate and load fluctuation of bone cutting was revealed. The proposed theories have potentially important implications for ultrasonic osteotome in spine surgery, neurosurgery etc.

Biography: Wei Bai is a Professor of Mechanical Engineering at China University of Geosciences. He received his PhD from Huazhong University of Science and Technology (China) in 2018. During 2016 to 2017, he was in Loughborough University (UK) under a joint PhD project, then he was a visiting scholar in the University of Tokyo (Japan) in 2018. He finished the postdoctoral research at Huazhong University of Science and Technology (China) from 2019 to 2021. His main research interest is in the following areas: innovative manufacturing processes, field-assisted precision manufacturing, ultrasound-assisted technology and equipment, digital twin and intelligent manufacturing, advanced robots, high-performance medical equipment. In the past five years, he has presided over the sub-projects of the National Key R&D Program, the Youth Fund of the National Natural Science Foundation, the Special Funding of China Postdoctoral Science Foundation, and participated in the National 973 Project, the High-quality Development Project of the Ministry of Industry and Information Technology, and Shenzhen Fundamental Research Program, etc. Professor Bai is a senior member of the Chinese Society of Mechanical Engineering, a member of the ASME, the IEEE, the Intelligent Manufacturing Professional Committee of the Chinese Society for Artificial Intelligence.